Memus Core - Latest Dicing Processing for MEMS
We are advancing the development and commercialization of new generation MEMS products.
In stealth dicing processing technology, MEMS wafers and LSI wafers can be divided into chips without "cutting lines" and through a "dry process," which is expected to yield significant benefits not found in conventional dicing methods. Especially in the development of MEMS devices with fragile structures, we recommend utilizing this technology from the design, prototyping, and development stages.
